US Patent 6891266 RF transition for an area array package
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Patent abstract
A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.
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Patent Inventor Names
Bernard A. Ziegner0
Jean-Pierre Lanteri0
M. Tekamul Buber0
Noyan Kinayman0
Richard Anderson0
Date of Patent
May 10, 2005
0Patent Application Number
100754060
Date Filed
February 14, 2002
0Patent Primary Examiner
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US Patent 6891266 RF transition for an area array package
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