Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masood Murtuza0
Muthiah Venkateswaran0
Satyendra Singh Chauhan0
Date of Patent
May 3, 2005
0Patent Application Number
104492120
Date Filed
May 30, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
In accordance with the present invention, a built-up bump pad structure and method for the same are provided. The bump pad structure includes a substrate, a bump pad disposed upon the substrate, a solder mask disposed upon the substrate defining an opening around the bump pad, and a conductive material deposited upon the bump pad such that the conductive material at least partially fills the opening around the bump pad.
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