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US Patent 6870554 Maskless lithography with multiplexed spatial light modulators

Patent 6870554 was granted and assigned to Anvik Corporation on March, 2005 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
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Current Assignee
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Anvik Corporation
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
68705540
Patent Inventor Names
Kanti Jain0
Date of Patent
March 22, 2005
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Patent Application Number
103377130
Date Filed
January 7, 2003
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Patent Primary Examiner
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Henry N. Tran
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Patent abstract

Imaging systems that use a spatial light modulator (SLM), such as maskless lithography systems using a digital micromirror device (DMD), suffer from low throughput at high resolution because of the increase in the number of pixels to be imaged. A possible solution to this problem is provided by using multiple SLMs. However, packaging multiple SLMs on a suitable base is inefficient because, in an SLM, surrounding the active region, a large inactive region is required for the chip kerf and the connector fan-in; these inactive regions thus prevent close packing of the SLMs. This invention enables close packing of a large number of SLMs by arranging them in twin planes, such that the kerf and fan-in regions overlap substantially. Variations in the optical conjugate distances of different SLMs caused by the twin planarity are eliminated by incorporation of a twin-pane compensating mirror array that corresponds to the SLM array, and introduces a pathlength difference between different mirrors that is complementary to the pathlength difference between corresponding SLM chips. Depth-of-focus problems are thus eliminated. The invention enables significant throughput enhancement, up to 82%, in maskless lithography systems.

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