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US Patent 12133049 Reduced light reflection package

Patent 12133049 was granted and assigned to Invensense, Inc. on October, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
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Invensense, Inc.
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Current Assignee
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Invensense, Inc.
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
121330490
Patent Inventor Names
Jr-Cheng Yeh0
Dinesh Kumar Solanki0
Roberto Brioschi0
Kazunori Hayata0
Date of Patent
October 29, 2024
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Patent Application Number
183714880
Date Filed
September 22, 2023
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Patent Citations
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US Patent 11117798 MEMS-sensor
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US Patent 11209271 Microelectromechanical device for detection of rotational motion
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Patent Primary Examiner
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Sean H Nguyen
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CPC Code
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B81B 2201/0264
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B81B 2201/0271
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B81B 2201/0292
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B81B 2203/0127
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B81B 2207/015
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B81B 7/0067
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B81B 7/0061
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B81C 1/00333
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Patent abstract

A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.

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