US Patent 12132002 Bridge interconnection with layered interconnect structures
Patent 12132002 was granted and assigned to Intel on October, 2024 by the United States Patent and Trademark Office.
Name
# Contributions
Last Contribution
Find more entities like US Patent 12132002 Bridge interconnection with layered interconnect structures
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.