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US Patent 12125784 Interconnect structures

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Date Filed
August 17, 2023
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Date of Patent
October 22, 2024
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Patent Application Number
18451366
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Patent Citations
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US Patent 10508030 Seal for microelectronic assembly
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US Patent 11385278 Security circuitry for bonded structures
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US Patent 11387202 Nanowire bonding interconnect for fine-pitch microelectronics
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US Patent 11387214 Multi-chip modules formed using wafer-level processing of a reconstituted wafer
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US Patent 11393779 Large metal pads over TSV
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US Patent 11462419 Microelectronic assemblies
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US Patent 11476213 Bonded structures without intervening adhesive
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US Patent 11515291 Integrated voltage regulator and passive components
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US Patent 11756880 Interconnect structures
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US Patent 6837979 Method and apparatus for depositing and controlling the texture of a thin film
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•••
Patent Inventor Names
Cyprian Emeka Uzoh
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Jeremy Alfred Theil
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Gaius Gillman Fountain, Jr.
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12125784
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Patent Primary Examiner
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Nitin Parekh
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CPC Code
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H01L 23/5226
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H01L 23/3178
0

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