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US Patent 12107065 Uniform chip gaps via injection-molded solder pillars

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
July 17, 2020
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Date of Patent
October 1, 2024
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Patent Application Number
16932290
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Patent Citations
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US Patent 8476773 Electrical interconnect structure
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US Patent 8877556 Copper post solder bumps on substrates
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US Patent 9013037 Semiconductor package with improved pillar bump process and structure
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US Patent 9095081 Double solder bumps on substrates for low temperature flip chip bonding
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US Patent 9971970 Microwave integrated quantum circuits with VIAS and methods for making the same
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US Patent 9836699 Microwave integrated quantum circuits with interposer
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US Patent 10134972 Qubit and coupler circuit structures and coupling techniques
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US Patent 6986454 Electronic package having controlled height stand-off solder joint
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US Patent 7810702 Solder standoffs for injection molding of solder
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Patent Inventor Names
Jae-Woong Nah
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Dongbing Shao
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Eric Peter Lewandowski
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12107065
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Patent Primary Examiner
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Hung K Vu
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