US Patent 12107064 Semiconductor package and manufacturing method thereof
Patent 12107064 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2024 by the United States Patent and Trademark Office.
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US Patent 12107064 Semiconductor package and manufacturing method thereof
Article
Patent abstract
A semiconductor package includes a substrate, a semiconductor device over the substrate and a plurality of solder joint structures bonded between the semiconductor device and the substrate, wherein each of the plurality of solder joint structures includes, by weight percent, 2% to 23% of Indium (In).
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Chiang Tsao0
Ching-Hua Hsieh0
Hao-Jan Pei0
Hsiu-Jen Lin0
Hsuan-Ting Kuo0
Jen-Jui Yu0
Mao-Yen Chang0
Date of Patent
October 1, 2024
0Patent Application Number
177193900
Date Filed
April 13, 2022
0Patent Citations
Patent Primary Examiner
CPC Code
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