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US Patent 12075587 Heat transfer interfaces for circuit card assembly (CCA) modules

Patent 12075587 was granted and assigned to Hamilton Sundstrand on August, 2024 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
Hamilton Sundstrand
Hamilton Sundstrand
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Current Assignee
Hamilton Sundstrand
Hamilton Sundstrand
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
120755870
Patent Inventor Names
Michael Doe, Jr.0
Anthony Matthew DeLugan0
Josh Kamp0
Judy Schwartz0
Alexander Trotman0
Robert DeFelice0
Date of Patent
August 27, 2024
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Patent Application Number
176739920
Date Filed
February 17, 2022
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Patent Citations
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US Patent 8787015 Liquid cooling system for stackable modules in energy-efficient computing systems
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US Patent 9357670 Efficient heat transfer from conduction-cooled circuit cards
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US Patent 10034403 Card retainer device
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US Patent 9414524 Extended heat frame for printed circuit board
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US Patent 7180737 Heat exchanger system for circuit card assemblies
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US Patent 7483271 High density card retention device
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US Patent 8223497 Thermal bridge extensions for a module-chassis interface
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US Patent 8477498 Conduction-cooled apparatus and methods of forming said apparatus
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...
Patent Primary Examiner
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Courtney L Smith
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Patent abstract

An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.

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