Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Robert Kalman0
Bardia Pezeshki0
Date of Patent
August 27, 2024
0Patent Application Number
179904250
Date Filed
November 18, 2022
0Patent Citations
0
Patent Primary Examiner
CPC Code
Patent abstract
In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.
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