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US Patent 12074144 Display device
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Patent
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Date Filed
April 14, 2023
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Date of Patent
August 27, 2024
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Patent Application Number
18134666
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Patent Citations
US Patent 8592232 Wafer level LED package and method of fabricating the same
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US Patent 8916898 Wafer level LED package and method of fabricating the same
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US Patent 9391233 Method for manufacturing light emitting device package
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US Patent 10224307 Assembling method, manufacturing method, device and electronic apparatus of flip-die
0
US Patent 10068888 Making semiconductor devices with alignment bonding and substrate removal
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US Patent 11205677 Micro-LED device, display apparatus and method for manufacturing a micro-LED device
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US Patent 7795629 Light-emitting diode display and method for manufacturing the same
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US Patent 8426227 Method of forming a micro light emitting diode array
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Patent Inventor Names
Motonobu Takeya
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
12074144
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Patent Primary Examiner
Nikolay K Yushin
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CPC Code
H01L 21/6835
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H01L 21/67144
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H01L 21/67
0
H01L 25/075
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H01L 25/0753
0
H01L 33/62
0
H01L 33/48
0
H01L 33/486
0
H01L 2933/0033
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H01L 2933/005
0
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