Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 12062618 Chip package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
November 30, 2023
0
Date of Patent
August 13, 2024
0
Patent Application Number
18524118
0
Patent Citations
‌
US Patent 9385105 Semiconductor devices
0
‌
US Patent 10192796 Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP
0
‌
US Patent 10490521 Advanced structure for info wafer warpage reduction
0
‌
US Patent 11538763 Chip package
0
‌
US Patent 11894306 Chip package
0
‌
US Patent 6839946 Method for fabricating a thin film bulk acoustic wave resonator (FBAR) on a glass substrate
0
‌
US Patent 6894358 Process for producing microelectromechanical components and a housed microelectromechanical component
0
‌
US Patent 6989604 Conformal barrier liner in an integrated circuit interconnect
0
‌
US Patent 7019406 Thermally enhanced semiconductor package
0
‌
US Patent 7038309 Chip package structure with glass substrate
0
•••
Patent Inventor Names
Ping-Jung Yang
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
12062618
0
Patent Primary Examiner
‌
Xiaoming Liu
0

Find more entities like US Patent 12062618 Chip package

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.