Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Keiji Kitagaito0
Maju Tomura0
Fumiya Kobayashi0
Date of Patent
August 13, 2024
0Patent Application Number
176622490
Date Filed
May 6, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
A plasma etching method for plasma-etching an object including an etching target film and a patterned mask. The plasma etching method includes a first step of plasma-etching the etching target film using the mask, and a second step of depositing a silicon-containing film using plasma of a silicon-containing gas on at least a part of a side wall of the etching target film etched by the first step.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.