US Patent 12028962 Thermal management of circuit boards
Patent 12028962 was granted and assigned to Micron Technology on July, 2024 by the United States Patent and Trademark Office.
All edits
Edits on 3 Jul, 2024
Golden AI
Edits made to:
Infobox (+27 properties)
Article (+592 characters)
US Patent 12028962 Thermal management of circuit boards
Article
Patent abstract
A semiconductor component system includes a motherboard and a cooling system mounted to the motherboard. The cooling system includes sidewalls projecting from the motherboard. A sub-motherboard extends between the sidewalls and is spaced apart from the motherboard. The sidewalls and the sub-motherboard define a cooling channel over the motherboard. A connector is attached to the sub-motherboard and is configured to receive a semiconductor device daughterboard. The connector has contacts to electrically couple the semiconductor device daughterboard to the sub-motherboard.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hyunsuk Chun0
Xiaopeng Qu0
Date of Patent
July 2, 2024
0Patent Application Number
178197160
Date Filed
August 15, 2022
0Patent Citations
Patent Primary Examiner
Find more entities like US Patent 12028962 Thermal management of circuit boards
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.