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US Patent 12027975 Packaged module with sintered switch

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 4, 2021
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Date of Patent
July 2, 2024
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Patent Application Number
17191816
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Patent Citations
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US Patent 7999369 Power electronic package having two substrates with multiple semiconductor chips and electronic components
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US Patent 9865398 Capacitor and method of manufacture thereof
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US Patent 9941234 Integrated packaging of multiple double sided cooling planar bond power modules
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US Patent 10027094 Power module, power converter and drive arrangement with a power module
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US Patent 10034401 Power semiconductor device and power conversion device
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US Patent 10037930 Power semiconductor module and manufacturing method of power semiconductor module
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US Patent 10178813 Stacked power module with integrated thermal management
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US Patent 10453742 Power semiconductor package having a parallel plate waveguide
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US Patent 10483229 Sintering device
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US Patent 10523094 Power inverter with liquid cooled busbars
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•••
Patent Inventor Names
Jean-Claude Harel
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12027975
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Patent Primary Examiner
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Yemane Mehari
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CPC Code
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H01L 23/31
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H02B 1/20
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H05K 7/1432
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H05K 7/209
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H01L 21/50
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H02M 1/327
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H02K 11/33
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H02M 3/1563
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H02M 7/003
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H02M 7/538466
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•••

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