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US Patent 12020992 Methods and apparatus for processing a substrate

Patent 12020992 was granted and assigned to Applied Materials on June, 2024 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

Patent

Current Assignee

Applied Materials

Date Filed

January 26, 2022

Date of Patent

June 25, 2024

Patent Application Number

17584669

Patent Citations

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US Patent 7561282 Techniques for determining overlay and critical dimension using a single metrology tool

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US Patent 7585686 Method and apparatus for processing a wafer

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US Patent 7759254 Method for forming impurity-introduced layer, method for cleaning object to be processed apparatus for introducing impurity and method for producing device

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US Patent 7985188 Vessel, coating, inspection and processing apparatus

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US Patent 10201660 Controlling the uniformity of PECVD deposition on medical syringes, cartridges, and the like

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US Patent 9572526 Apparatus and method for transporting a vessel to and from a PECVD processing station

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US Patent 10312217 Method for low temperature bonding and bonded structure

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US Patent 6872428 Apparatus and method for large area chemical vapor deposition using multiple expanding thermal plasma generators

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US Patent 7158221 Method and apparatus for performing limited area spectral analysis

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US Patent 7414721 In-situ metrology system and method for monitoring metalization and other thin film formation

Patent Inventor Names

Muhammad Avicenna Naradipa

Prayudi Lianto

Andrivo Rusydi

Arvind Sundarrajan

Guan Huei See

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

12020992

Patent Primary Examiner

CPC Code

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