US Patent 12016153 Enhanced thermal management in electrical boxes

An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.