Patent attributes
An electronic device is provided that includes a PCB and a cooling system adapted to pull heat away from a first side of the PCB and dissipate the heat through a back surface of the electronic device. The cooling system includes a heat pipe that wraps around PCB. The cooling system further includes an active heat transfer device positioned adjacent to a second portion of the heat pipe, the active heat transfer device being adapted to absorb heat through a first surface and release the heat through a second surface of the active heat transfer device. The cooling system further includes a first passive heat transfer element that forms the back surface of the electronic device and that conducts the heat received from the active heat transfer device out of the electronic device.
