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US Patent 12013800 Die-to-die and chip-to-chip connectivity monitoring

Patent 12013800 was granted and assigned to ProteanTecs on June, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
ProteanTecs
ProteanTecs
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Date Filed
June 14, 2023
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Date of Patent
June 18, 2024
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Patent Applicant
ProteanTecs
ProteanTecs
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Patent Application Number
18209685
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Patent Citations
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US Patent 7254507 Analog circuit automatic calibration system
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US Patent 7369893 Method and apparatus for identifying lead-related conditions using prediction and detection criteria
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US Patent 7443189 Method to detect and predict metal silicide defects in a microelectronic device during the manufacture of an integrated circuit
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US Patent 7455450 Method and apparatus for temperature sensing in integrated circuits
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US Patent 7501832 Method and circuit for the detection of solder-joint failures in a digital electronic package
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US Patent 7649373 Semiconductor integrated circuit with voltage drop detector
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US Patent 7701246 Programmable delay line compensated for process, voltage, and temperature
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US Patent 7818601 Method and apparatus for data transfer
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US Patent 7877657 Look-ahead built-in self tests
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US Patent 7940862 Data decoding method and data decoding device employing same
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•••
Patent Citations Received
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US Patent 12123908 Loopback testing of integrated circuits
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Patent Inventor Names
Eyal Fayneh
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Guy Redler
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Evelyn Landman
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12013800
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Patent Primary Examiner
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Elias Mamo
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