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US Patent 12013432 Thermal control wafer with integrated heating-sensing elements
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Patent
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Date Filed
August 23, 2023
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Date of Patent
June 18, 2024
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Patent Application Number
18454741
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Patent Citations
US Patent 7196295 Two-wire layered heater system
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US Patent 7601935 Two-wire hot runner nozzle heater system
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US Patent 8289040 Test wafer unit and test system
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US Patent 8680443 Combined material layering technologies for electric heaters
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US Patent 9713345 Device and method for controlling an electrical heater to limit temperature
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US Patent 10104718 Temperature detection and control system for layered heaters
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US Patent 10760465 Heater element having targeted decreasing temperature resistance characteristics
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US Patent 11340283 Testing device
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US Patent 10934921 Heater element as sensor for temperature control in transient systems
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US Patent 11674999 Wafer scale active thermal interposer for device testing
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•••
Patent Inventor Names
Samer Kabbani
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Sorin Dinescu
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Terry Sinclair Connacher
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Enrique Aleman
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Carl L. Ostrowski
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Thomas P. Jones
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
12013432
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Patent Primary Examiner
Tung X Nguyen
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CPC Code
G01R 31/2891
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G01R 31/2874
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G01R 31/2607
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