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US Patent 12012667 Copper electrofill on non-copper liner layers

Patent 12012667 was granted and assigned to Lam Research on June, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Lam Research
Lam Research
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Date Filed
April 5, 2019
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Date of Patent
June 18, 2024
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Patent Applicant
Lam Research
Lam Research
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Patent Application Number
17045657
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Patent Citations
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US Patent 8268155 Copper electroplating solutions with halides
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US Patent 7232513 Electroplating bath containing wetting agent for defect reduction
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US Patent 7449099 Selectively accelerated plating of metal features
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US Patent 10214826 Low copper electroplating solutions for fill and defect control
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Patent Inventor Names
Yi Hua Liu
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Jonathan David Reid
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Lee J. Brogan
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12012667
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Patent Primary Examiner
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Stefanie S Wittenberg
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CPC Code
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C25D 3/38
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