US Patent 12011942 Rules for sensor integrated substrates

Methods of manufacturing a wound monitoring and/or therapy apparatus and/or wound dressing include positioning electronic components and connections in regions of a substrate that are not configured to be perforated. The methods can also include following a set of rules for positioning the components as well as positioning and shaping the connections based on the constraints stemming from, among other things, the positioning of the perforations on the substrate and with the goal of maintaining acceptable levels of signal integrity. The methods further include manufacturing a multi-layered substrate. Wound monitoring and/or therapy apparatus manufactured using such methods are also disclosed.