Log in
Enquire now
‌

US Patent 12006209 MEMS and NEMS structures

Patent 12006209 was granted and assigned to Obsidian Sensors, Inc. on June, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
‌
Obsidian Sensors, Inc.
0
Current Assignee
‌
Obsidian Sensors, Inc.
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
120062090
Patent Inventor Names
Yaoling Pan0
Sean Andrews0
Edward Chan0
Bing Wen0
Tallis Chang0
John Hong0
Date of Patent
June 11, 2024
0
Patent Application Number
169807920
Date Filed
March 14, 2019
0
Patent Citations
‌
US Patent 7667200 Thermal microphotonic sensor and sensor array
0
Patent Primary Examiner
‌
Walter H Swanson
0
CPC Code
‌
B81B 2203/019
0
‌
B81B 2201/0207
0
‌
B81B 3/0081
0
‌
B81C 2201/014
0
‌
B81C 2201/0105
0
‌
B81C 1/0069
0
‌
B81C 1/00595
0
Patent abstract

A method of manufacturing an electromechanical systems structure includes manufacturing sub-micron structural features. In some embodiments, the structural features are less than the lithographic limit of a lithography process.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 12006209 MEMS and NEMS structures

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.