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US Patent 11999001 Advanced device assembly structures and methods

Overview Structured Data Issues Contributors

Is a

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Date Filed

December 8, 2021

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Date of Patent

June 4, 2024

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Patent Application Number

17545322

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Patent Citations

US Patent 8240545 Methods for minimizing component shift during soldering

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US Patent 9024205 Advanced device assembly structures and methods

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US Patent 7060601 Packaging substrates for integrated circuits and soldering methods

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US Patent 7452798 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

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US Patent 7777233 Device containing non-blinking quantum dots

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US Patent 7919342 Patterned inorganic LED device

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US Patent 7009299 Kinetically controlled solder

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Patent Inventor Names

Cyprian Emeka Uzoh

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

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Patent Primary Examiner

Ishwarbhai B. Patel

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CPC Code

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H01L 2224/02372

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H01L 2224/03912

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