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US Patent 11990436 Electronic circuit for a hybrid molecular bonding
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Is a
Patent
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Date Filed
November 5, 2021
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Date of Patent
May 21, 2024
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Patent Application Number
17519957
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Patent Citations
US Patent 11862602 Scalable architecture for reduced cycles across SOC
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US Patent 10515913 Multi-metal contact structure
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Patent Inventor Names
Amandine Jouve
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Emilie Bourjot
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11990436
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Patent Primary Examiner
Dale E Page
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CPC Code
H01L 2224/06132
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H01L 24/06
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