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US Patent 11988874 Data processing systems including optical communication modules

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
119888740
Patent Inventor Names
Peter Johannes Winzer0
Guilhem de Valicourt0
Peter James Pupalaikis0
Clinton Randy Giles0
Date of Patent
May 21, 2024
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Patent Application Number
174953380
Date Filed
October 6, 2021
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Patent Citations
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US Patent 8780551 Blade and air deflector in a plenum
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US Patent 10615903 Method and system for a polarization immune wavelength division multiplexing demultiplexer
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US Patent 10725245 High-density fabric systems interconnected with multi-port aggregated cables
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US Patent 10866376 Method and system for co-packaging photonics integrated circuit with an application specific integrated circuit
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US Patent 11005572 Temperature-locked loop for optical elements having a temperature-dependent response
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US Patent 11058034 Modular network switch
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US Patent 11107770 Integrated electrical/optical interface with two-tiered packaging
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US Patent 11165509 Method for co-packaging light engine chiplets on switch substrate
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Patent Primary Examiner
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Jasmine J Clark
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CPC Code
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G02B 6/43
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G02B 6/4249
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G02B 6/42
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H05K 2201/10121
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H05K 1/0243
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H05K 1/181
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H05K 1/0274
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H05K 1/141
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Patent abstract

An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.

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