Patent 11982431 was granted and assigned to Lumileds on May, 2024 by the United States Patent and Trademark Office.
A LED lighting module is described that is realized as a printed circuit assembly. The LED lighting module has a carrier with a strip of dielectric material and conductive circuit tracks printed on the dielectric material. Bare LED dies are mounted in a linear formation on the carrier. The width of the LED die formation does not exceed 0.75 mm and the area of the emission face of an LED die does not exceed 0.0625 mm2. Drivers are mounted on the carrier and are connected to drive the LED dies.