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US Patent 11974387 Power module and heat sink system
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Is a
Patent
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Date Filed
July 19, 2022
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Date of Patent
April 30, 2024
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Patent Application Number
17867774
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Patent Citations
US Patent 8125781 Semiconductor device
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US Patent 11653481 Electric power conversion device
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US Patent 7919854 Semiconductor module with two cooling surfaces and method
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US Patent 10424570 Power conversion apparatus
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Patent Inventor Names
Cheng Li
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Nianbin Cheng
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Lifang Liang
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Xiangxuan Tan
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Yikai Yuan
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Honggui Zhan
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11974387
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Patent Primary Examiner
Zachary Pape
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CPC Code
H01L 23/481
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H01L 23/49568
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H01L 23/3677
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H01L 23/473
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H01L 23/04
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H01L 23/10
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H01L 25/072
0
H01L 29/42304
0
H01L 24/41
0
H01L 2224/0603
0
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