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US Patent 11971220 Evaporative cooling for transducer array

Patent 11971220 was granted and assigned to BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. on April, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
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BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
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Current Assignee
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BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119712200
Patent Inventor Names
Charles P. Wason, Jr.0
Date of Patent
April 30, 2024
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Patent Application Number
181668080
Date Filed
February 9, 2023
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Patent Citations
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US Patent 9267743 Housing for electronic equipment with variable coolant channel widths
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US Patent 9423188 Molded plastic objects having an integrated heat spreader and methods of manufacture of same
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US Patent 8235096 Hydrophilic particle enhanced phase change-based heat exchange
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Patent Primary Examiner
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Daniel L Murphy
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CPC Code
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F02D 41/02
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F02D 29/00
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F02D 21/08
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F02D 41/021
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F02D 41/0077
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F02D 41/06
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F02D 41/0047
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F02D 35/00
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Patent abstract

A transducer system comprising a housing, an electromechanical transducer within the housing, a wicking material adjacent to a portion of the electromechanical transducer, and a multi-phase coolant solution within the housing. The multi-phase coolant solution transitions from a first phase to a second phase in response to a temperature of the electromechanical transducer exceeding a threshold temperature. In some example cases, the multi-phase coolant solution has a boiling point of less than about 60° C., which effectively defines the threshold temperature. The multi-phase coolant solution may be chosen such that it remains a liquid during a first phase (cooling via conduction), and then evaporates during a second phase (cooling via conduction and convection) as the electromechanical transducer heats up.

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