US Patent 11966804 RFID and packaging substrate systems and methods

In some embodiments, an RFID device includes an RFID chip, a first antenna coupled to the RFID chip, and a cardboard substrate. The RFID chip may be at least one of attached to the cardboard substrate at a position and embedded within the cardboard substrate at the position. The cardboard substrate may form at least part of a carton blank configured to cover the RFID chip position with at least one layer of cardboard when the carton blank has been assembled into a closed box.