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US Patent 11966330 Link affinitization to reduce transfer latency

Patent 11966330 was granted and assigned to Intel on April, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
Intel
Intel
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Current Assignee
Intel
Intel
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119663300
Patent Inventor Names
Vinit Mathew Abraham0
Yen-Cheng Liu0
Jeffrey D. Chamberlain0
Soumya S. Eachempati0
Eswaramoorthi Nallusamy0
Date of Patent
April 23, 2024
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Patent Application Number
168944020
Date Filed
June 5, 2020
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Patent Citations
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US Patent 10534687 Method and system for cache agent trace and capture
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US Patent 7315919 Bandwidth reduction technique in a snooping-based cache-coherent cluster of multiprocessing nodes
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US Patent 9606925 Method, apparatus and system for optimizing cache memory transaction handling in a processor
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US Patent 10339060 Optimized caching agent with integrated directory cache
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US Patent 10402327 Network-aware cache coherence protocol enhancement
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US Patent 11016913 Inter cluster snoop latency reduction
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Patent Primary Examiner
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Christopher B. Shin
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CPC Code
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G06F 13/4027
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G06F 2213/40
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G06F 12/0802
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G06F 13/1668
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G06F 2213/16
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Patent abstract

Examples described herein relate to processor circuitry to issue a cache coherence message to a central processing unit (CPU) cluster by selection of a target cluster and issuance of the request to the target cluster, wherein the target cluster comprises the cluster or the target cluster is directly connected to the cluster. In some examples, the selected target cluster is associated with a minimum number of die boundary traversals. In some examples, the processor circuitry is to read an address range for the cluster to identify the target cluster using a single range check over memory regions including local and remote clusters. In some examples, issuance of the cache coherence message to a cluster is to cause the cache coherence message to traverse one or more die interconnections to reach the target cluster.

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