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US Patent 11963331 Fully redundant cooling unit with phase change flow control unit

Patent 11963331 was granted and assigned to Baidu Usa on April, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Baidu Usa
Baidu Usa
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Current Assignee
Baidu Usa
Baidu Usa
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119633310
Patent Inventor Names
Tianyi Gao0
Date of Patent
April 16, 2024
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Patent Application Number
173600580
Date Filed
June 28, 2021
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Patent Citations
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US Patent 8606414 Multi-channel chemical transport bus providing short-duration burst transport using sensors for microfluidic and other applications
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US Patent 7088585 Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems
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US Patent 7106590 Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems
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US Patent 10238010 Rackmount appliance for server and rack liquid management and water control policy execution
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US Patent 10917998 Rack information handling system having modular liquid distribution (MLD) conduits
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US Patent 10966349 Two-phase immersion cooling apparatus with active vapor management
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US Patent 9010141 Computer cooling system and method of use
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US Patent 9750165 Coolant and ambient temperature control for chillerless liquid cooled data centers
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Patent Primary Examiner
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Darrin D Dunn
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CPC Code
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H05K 7/208
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H05K 7/20318
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H05K 7/20327
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H05K 7/20627
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H05K 7/20663
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H05K 7/207
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H05K 7/20727
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H05K 7/20763
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Patent abstract

In one embodiment, a liquid cooling apparatus includes a first cooling loop to provide cooling liquid to a heat load, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line and a second cooling loop to provide cooling liquid to the heat load, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line, wherein the first vapor return line and the second vapor return line are coupled by an interconnection loop. The liquid cooling apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line, and at least one main cooling source controlled based on the first pressure sensor and the second pressure sensor.

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