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US Patent 11962057 Glass based empty substrate integrated waveguide devices

Patent 11962057 was granted and assigned to 3D Glass Solutions, Inc. on April, 2024 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
3D Glass Solutions, Inc.
3D Glass Solutions, Inc.
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Current Assignee
3D Glass Solutions, Inc.
3D Glass Solutions, Inc.
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119620570
Patent Inventor Names
Jeb H. Flemming0
Roger Cook0
Kyle McWethy0
Date of Patent
April 16, 2024
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Patent Application Number
175980090
Date Filed
April 3, 2020
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Patent Citations
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US Patent 7064045 Laser based method and device for forming spacer structures for packaging optical reflection devices
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US Patent 7179638 Microarrays and their manufacture by slicing
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US Patent 7277151 Flat panel display with photosensitive glass spacer
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US Patent 7306689 Optical waveguide and method for producing same
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US Patent 7326538 Binding proteins as biosensors
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US Patent 7407768 Membrane-based assays
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US Patent 7410763 Multiplex data collection and analysis in bioanalyte detection
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Patent Primary Examiner
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John W Poos
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CPC Code
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H01L 2223/6627
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H01P 3/121
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H01P 11/002
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H01P 5/107
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H01P 3/12
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H01P 11/001
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H01P 3/003
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H01P 5/028
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Patent abstract

The present invention includes a method of creating high Q empty substrate integrated waveguide devices and/or system with low loss, mechanically and thermally stabilized in photodefinable glass ceramic substrate. The photodefinable glass ceramic process enables high performance, high quality, and/or low-cost structures. Compact low loss RF empty substrate integrated waveguide devices are a cornerstone technological requirement for RF systems, in particular, for portable systems.

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