Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11955445 Metal pads over TSV

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
June 9, 2022
0
Date of Patent
April 9, 2024
0
Patent Application Number
17836840
0
Patent Citations
‌
US Patent 10840205 Chemical mechanical polishing for hybrid bonding
0
‌
US Patent 10950547 Stacked IC structure with system level wiring on multiple sides of the IC die
0
‌
US Patent 10964664 DBI to Si bonding for simplified handle wafer
0
‌
US Patent 10985133 Die processing
0
‌
US Patent 10991804 Transistor level interconnection methodologies utilizing 3D interconnects
0
‌
US Patent 10998292 Offset pads over TSV
0
‌
US Patent 11011494 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
0
‌
US Patent 11011503 Direct-bonded optoelectronic interconnect for high-density integrated photonics
0
‌
US Patent 11031285 Diffusion barrier collar for interconnects
0
‌
US Patent 11037919 Techniques for processing devices
0
•••
Patent Inventor Names
Belgacem Haba
0
Cyprian Emeka Uzoh
0
Gaius Gillman Fountain, Jr.
0
Laura Wills Mirkarimi
0
Rajesh Katkar
0
Guilian Gao
0
Bongsub Lee
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11955445
0
Patent Primary Examiner
‌
Bilkis Jahan
0
CPC Code
‌
H01L 24/06
0
‌
H01L 24/09
0
‌
H01L 25/0657
0
‌
H01L 25/50
0
‌
H01L 24/03
0
‌
H01L 24/80
0
‌
H01L 21/76898
0
‌
H01L 24/08
0
‌
H01L 23/481
0

Find more entities like US Patent 11955445 Metal pads over TSV

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.