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US Patent 11955393 Structures for bonding elements including conductive interface features

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 US Patent 11955393 Structures for bonding elements including conductive interface features

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Patent abstract

A bonded structure is disclosed. The bonded structure includes a first element and a second element that is bonded to the first element along a bonding interface. The bonding interface has an elongate conductive interface feature and a nonconductive interface feature. The bonded structure also includes an integrated device that is coupled to or formed with the first element or the second element. The elongate conductive interface feature has a recess through a portion of a thickness of the elongate conductive interface feature. A portion of the nonconductive interface feature is disposed in the recess.

Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
119553930
Patent Inventor Names
Bongsub Lee0
Cyprian Emeka Uzoh0
Gaius Gillman Fountain, Jr.0
Laura Wills Mirkarimi0
Rajesh Katkar0
Date of Patent
April 9, 2024
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Patent Application Number
173151700
Date Filed
May 7, 2021
0
Patent Citations
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Patent Primary Examiner
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Laura M Menz
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