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US Patent 11948981 Seam-filling of metal gates with Si-containing layers
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Is a
Patent
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Date Filed
August 18, 2021
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Date of Patent
April 2, 2024
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Patent Application Number
17405406
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Patent Citations
US Patent 10461167 Semiconductor device and method of manufacturing the same
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US Patent 11387346 Gate patterning process for multi-gate devices
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Patent Inventor Names
Weng Chang
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Chi On Chui
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Hsin-Yi Lee
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11948981
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Patent Primary Examiner
Reema Patel
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CPC Code
H01L 29/66545
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H01L 29/42392
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H01L 29/401
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H01L 21/82345
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H01L 21/823437
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