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US Patent 11948847 Bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
May 31, 2022
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Date of Patent
April 2, 2024
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Patent Application Number
17829185
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Patent Citations
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US Patent 10854578 Diffused bitline replacement in stacked wafer memory
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US Patent 11256004 Direct-bonded lamination for improved image clarity in optical devices
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US Patent 11257727 Seal for microelectronic assembly
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US Patent 11264357 Mixed exposure for large die
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US Patent 11276676 Stacked devices and methods of fabrication
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US Patent 11329034 Direct-bonded LED structure contacts and substrate contacts
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US Patent 11348898 Systems and methods for releveled bump planes for chiplets
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US Patent 11355443 Dielets on flexible and stretchable packaging for microelectronics
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US Patent 11380597 Bonded structures
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US Patent 11417576 Seal for microelectronic assembly
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•••
Patent Inventor Names
Rajesh Katkar
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Liang Wang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11948847
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Patent Primary Examiner
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Jaehwan Oh
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CPC Code
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H01L 24/09
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H01L 21/3221
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H01L 23/26
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H01L 23/10
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H01L 27/085
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H01L 24/05
0
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H01L 24/03
0

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