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US Patent 11947173 Photonic semiconductor device and method of manufacture

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
May 5, 2023
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Date of Patent
April 2, 2024
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Patent Application Number
18312767
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Patent Citations
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US Patent 11482649 Semiconductor package and manufacturing method of semiconductor package
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US Patent 9285554 Through-substrate optical coupling to photonics chips
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US Patent 10267988 Photonic package and method forming same
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US Patent 11506843 Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap
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Patent Inventor Names
Chen-Hua Yu
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Hua-Kuei Lin
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Hung-Yi Kuo
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Cheng-Chieh Hsieh
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Tsung-Yuan Yu
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Che-Hsiang Hsu
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Hao-Yi Tsai
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Chung-Ming Weng
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Chung-Shi Liu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11947173
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Patent Primary Examiner
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Jerry Rahll
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