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US Patent 11931991 Packaging structures and additive manufacturing thereof

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119319910
Patent Inventor Names
Marc Esformes0
Nicole Distefano0
Robert W. Klein0
Date of Patent
March 19, 2024
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Patent Application Number
171665330
Date Filed
February 3, 2021
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Patent Citations
‌
US Patent 8236060 Tethered joint bearing implants and systems
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US Patent 8556983 Patient-adapted and improved orthopedic implants, designs and related tools
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US Patent 8652210 Femoral prostheses with lateral buttress for patella
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US Patent 8728387 Laser-produced porous surface
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US Patent 8771365 Patient-adapted and improved orthopedic implants, designs, and related tools
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US Patent 8777875 System and method for manufacturing arthroplasty jigs having improved mating accuracy
0
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US Patent 8911502 Implant for restoring normal range flexion and kinematics of the knee
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US Patent 8926706 Patient-adapted and improved articular implants, designs and related guide tools
0
...
Patent Primary Examiner
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Joseph S Del Sole
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CPC Code
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A61F 2/0095
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B29L 2031/712
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B29C 64/118
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B33Y 10/00
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B33Y 30/00
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B33Y 80/00
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B32B 38/145
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B32B 2439/00
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...
Patent abstract

A packaging system includes a packaging unit and an article. The packaging unit includes a solid layer, a porous layer and a plastic layer with a cavity. The cavity is configured to receive and secure the article in an opening defined by the cavity that is flexible between a first and a second dimension. The packaging unit is fabricated by a 3D printing process. A tensioning device of a 3D printing machine tensions a feed filament during the 3D printing process.

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