US Patent 11908834 Multi-chip package with reinforced isolation
Patent 11908834 was granted and assigned to Texas Instruments on February, 2024 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
May 10, 2022
1
Date of Patent
February 20, 2024
1
Patent Applicant
Patent Application Number
17741402
1
Patent Inventor Names
Vivek Arora
1
Woochan Kim
1
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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