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US Patent 11908739 Flat metal features for microelectronics applications

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
November 13, 2020
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Date of Patent
February 20, 2024
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Patent Application Number
17098128
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Patent Citations
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US Patent 10840205 Chemical mechanical polishing for hybrid bonding
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US Patent 11011494 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
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US Patent 11011503 Direct-bonded optoelectronic interconnect for high-density integrated photonics
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US Patent 11031285 Diffusion barrier collar for interconnects
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US Patent 11056348 Bonding surfaces for microelectronics
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US Patent 11176450 Three dimensional circuit implementing machine trained network
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US Patent 11244920 Method and structures for low temperature device bonding
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US Patent 11256004 Direct-bonded lamination for improved image clarity in optical devices
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US Patent 11264357 Mixed exposure for large die
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US Patent 11276676 Stacked devices and methods of fabrication
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•••
Patent Inventor Names
Cyprian Emeka Uzoh
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11908739
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Patent Primary Examiner
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Robert G Bachner
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CPC Code
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H01L 2224/08135
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H01L 2224/08145
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H01L 2224/08121
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H01L 2224/08146
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H01L 2224/08147
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H01L 2224/80357
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H01L 2224/0812
0
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H01L 2224/08123
0
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H01L 2224/08111
0

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