US Patent 11904489 Cutting device

A cutting device includes a placement member on which an object to be cut is placed and a mounting portion to which a cutting blade is mounted. The cutting device detects, in the course of the mounting portion moving, a pressure correspondence value corresponding to a pressure applied to the mounting portion, and a movement amount of the mounting portion, decides a cutting pressure correspondence value that is the pressure correspondence value corresponding to a cutting pressure, on the basis of the pressure correspondence value and the movement amount after the cutting blade has come into contact with the object to be cut, and acquires cutting data. The cutting device further applies in accordance with the acquired cutting data, the cutting pressure corresponding to the decided cutting pressure correspondence value to the mounting portion, and cuts the object to be cut, using the cutting blade mounted to the mounting portion.