Patent attributes
A method, system, apparatus, and/or device with a miniaturized impedance sensor. The method, system, apparatus, and/or device may include a substrate with locally non-flexible regions interconnected by a flexible material and a miniaturized impedance sensor disposed on the substrate. The miniaturized impedance sensor may include: an array of electrical contacts; an array of miniaturized electrodes disposed on the array of electrical contacts; and an interstitial filler disposed within the array of miniaturized electrodes. The locally non-flexible regions may correspond to subsets of the array of miniaturized electrodes. The locally non-flexible regions may retain shape as the flexible material changes shape.