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US Patent 11890707 Device assembling system, method, and apparatus

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
118907070
Patent Inventor Names
Hongda Li0
Di Wu0
Yuan Cheng0
Xian Zhang0
Date of Patent
February 6, 2024
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Patent Application Number
181512760
Date Filed
January 6, 2023
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Patent Citations
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US Patent 10398055 Portable server assembly system
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US Patent 11415967 Method for assembling a cooling apparatus, an assembling line implementing the same, and a compartment of said cooling apparatus
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US Patent 9908239 Mobile robot system
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Patent Citations Received
0
Patent Primary Examiner
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Bayan Salone
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CPC Code
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G05B 2219/40033
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G05B 2219/40059
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G05B 2219/45045
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G05B 19/418
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G05B 19/41805
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G06F 16/1767
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B25J 9/1682
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Y02P 90/02
0
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Patent abstract

A device assembling system includes a management apparatus, a material apparatus, and an execution apparatus. The management apparatus is communicatively connected to the material apparatus and the execution apparatus, and the material apparatus and the execution apparatus are installed into an overall structure. The management apparatus is configured to obtain a maintenance task of a maintenance device. The maintenance task includes an operation type and an operation object. The management apparatus parses the maintenance task into a first control instruction and a second control instruction. The material apparatus receives the first control instruction, and searches for a to-be-assembled part according to the first control instruction, that is, the material apparatus may determine a position of the to-be-assembled part. The execution apparatus receives the second control instruction, and obtains the to-be-assembled part and assembles the to-be-assembled part to a device according to the second control instruction.

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