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US Patent 11882709 High resolution advanced OLED sub-pixel circuit and patterning method

Patent 11882709 was granted and assigned to Applied Materials on January, 2024 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Applicant
Applied Materials
Applied Materials
1
Current Assignee
Applied Materials
Applied Materials
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
118827091
Patent Inventor Names
Yu-hsin Lin1
Jungmin Lee1
Ji Young Choung1
Chung-chia Chen1
Date of Patent
January 23, 2024
1
Patent Application Number
183153621
Date Filed
May 10, 2023
1
Patent Citations
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US Patent 10615231 Organic light emitting diode substrate, method for manufacturing the same, and display panel
1
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US Patent 10580843 Substrate and fabrication method thereof, and display device
1
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US Patent 8686629 Organic light emitting display device with partition wall having first and second tapered structures
1
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US Patent 8987717 Organic light emitting diode display and method of fabricating the same
1
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US Patent 9324962 Organic luminescence display and method of manufacturing the same
1
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US Patent 9337244 Light-emitting device and electronic device using light-emitting device
1
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US Patent 10170526 Organic light emitting diode display panel and method for manufacturing same
1
Patent Primary Examiner
‌
Nduka E Ojeh
1
Patent abstract

Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

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