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US Patent 11875101 Method for patterning process modelling

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Date Filed
May 25, 2020
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Date of Patent
January 16, 2024
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Patent Application Number
17616368
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Patent Citations
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US Patent 10032681 Etch metric sensitivity for endpoint detection
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US Patent 10007742 Particle flow simulation system and method
0
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US Patent 10242142 Predictive 3-D virtual fabrication system and method
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US Patent 6961116 Lithographic apparatus, device manufacturing method, and device manufactured thereby
0
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US Patent 9588438 Optimization flows of source, mask and projection optics
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Patent Inventor Names
Feng Chen
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Jan Wouter Bijlsma
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Matteo Alessandro Francavilla
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Jen-Shiang Wang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11875101
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Patent Primary Examiner
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Leigh M. Garbowski
0

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