US Patent 11869760 Power electronic device assemblies having an electrically insulating layer

Power electronics device assemblies, circuit board assemblies, and power electronics assemblies are disclosed. In one embodiment, a power electronics device assembly includes an S-cell including a first metal layer, a first graphite layer bonded to the first metal layer, an electrically insulating layer bonded to the first graphite layer, a second graphite layer bonded to the electrically insulating layer and a second metal layer bonded to the second graphite layer, the second metal layer comprising a surface and a recess provided within the surface. The power electronics device assembly further includes a power electronics device disposed within the recess of the surface.