US Patent 11862572 Laser-based redistribution and multi-stacked packages

Overview Structured Data Issues Contributors Activity

Is a

Patent

Date Filed

January 30, 2023

Date of Patent

January 2, 2024

Patent Application Number

18161693

Patent Citations

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US Patent 9331007 Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages

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US Patent 9406533 Methods of forming conductive and insulating layers

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US Patent 7633765 Semiconductor package including a top-surface metal layer for implementing circuit features

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US Patent 8283205 Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

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US Patent 9202742 Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof

Patent Citations Received

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US Patent 12074116 Integrated package structure

Patent Inventor Names

KyoungHee Park

ChangOh Kim

JinHee Jung

SeongHwan Park

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

11862572

Patent Primary Examiner

CPC Code

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