US Patent 11862429 Ion implantation method and device
Patent 11862429 was granted and assigned to Taiwan Semiconductor Manufacturing Company on January, 2024 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 1, 2021
0
Date of Patent
January 2, 2024
0
Patent Applicant
Patent Application Number
17516426
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Patent Inventor Names
Yao-Jen Yeh
0
Chia-Lin Ou
0
Yi-Hsiung Lin
0
Cheng-En Lee
0
Hsuan-Pang Liu
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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