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US Patent 11853250 Interconnect interface

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Is a
Patent
Patent
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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
118532500
Patent Inventor Names
Peng Shen0
Fan Yang0
Chunhui Zheng0
Shuai Zhang0
Weilin Wang0
Date of Patent
December 26, 2023
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Patent Application Number
175061240
Date Filed
October 20, 2021
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Patent Citations
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US Patent 11526460 Multi-chip processing system and method for adding routing path information into headers of packets
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US Patent 10505851 Transmission burst control in a network device
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US Patent 11569939 Synchronizing a high-speed signaling interconnect
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US Patent 9929928 Packet transmitter and method for timestamping packets
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US Patent 10339059 Global socket to socket cache coherence architecture
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Patent Primary Examiner
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Henry Tsai
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Patent abstract

An interconnect interface is applied between sockets or between dies. The interconnect interface includes a first transmitter (TX), a first receiver (RX), and an electrical physical layer (EPHY) coupled between the first TX and the first RX. The data provided by a first device is transmitted from the first TX to the EPHY and then received by the first RX to be retrieved by a second device. The first TX includes an arbiter for arbitrating between a plurality of channels of the first device to obtain data from the first device. The first TX includes a packet generator, which packs the data obtained from the first device into a packet to be transmitted through the EPHY. The first TX further includes a first buffer that backs up the data obtained from the first device for retransmission.

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